OPTOPAC Inc
OptoPAC Inc. that design and develop WLCSP(Wafer Level Chip Scale Package) for CMOS and CCD Image Sensor has been grown as a venture company since Oct 2003. Also OptoPAC is based on the specific patent technologies and know-how in Image Sensor Package fields. We were the first to actualize WLCSP made use of 8" glass wafer based on the specific patent technologies. Finally, we provide our customers with the maximum satisfaction with competitive WLCSP through the price, size and reliability. Recently, as market of Image Sensor, Camera module is advanced very rapidly, we become competitive with each other for the top of technology and quality within rapid distribution of Camera Phone and Digital Camera over the world. Under this circumstances, we will do our best for providing our customers with reliable products and services as the leader of WLCSP fields based on key technology and research. Once again I cordially thank you for your visits to the homepage. I would like to ask you a favor that you will utilize our homepage plentifully, also you will continuously cooperate for the homepage.
